Powered by the 3rd Generation Intel® Xeon® Scalable Processors (formerly Ice Lake-SP), the ARES-WHI0...Read more
3.5” SubCompact Board with Intel® 7th Generation U Core™ i7/i5/i3/Celeron® Processor SoC
All versions of the GENE-KBU6 are designed with a fanless heatsink that facilitate heat mitigation and airflow, ensuring product quality and longevity. This 3.5″ single board is specifically designed for applications such as Robotics and Industrial Automation, and is powered by the latest Intel Kabylake processor, facilitating faster processing time and better image resolution. Field tests have shown that the GENE-KBU6 surpasses the Skylake model by 20%, and provides a 10% improvement in graphics power.
A product byAAEON